1.

What are the precautions to be observed while working on Ball Grid Array (BGA ICs).

Answer»

Storage 

I. Take care so that packages are not subjected to impact, vibration or water leakage. 

II. Do not store and use the product under the environment in which moisture condensation may be formed due to rapid changes in temperature. Also, please do not apply load to the products during storage. 

III. When storing, avoid dusty locations or locations with corrosive gases. 

IV. Before opening moisture-proof bag, please make sure that the moisture-proof bag is not broken or scratched. Also check the silica gel in the bag has not absorbed moisture, after the bag is opened. 

V. When using after a long term of storage, use after confirming that terminal discoloration, solder ability deterioration and so on, does not occur.



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