1.

In the silver plating of copper, K[Ag(CN)_(2)] is used instead of AgNO_(3). The reason is

Answer»

a thin layer of Ag is FORMED on Cu
more voltage is REQUIRED
`Ag^(+)` ions are completely removed from solution
less avalability of `Ag^(+)` ions, as Cu cannot displace Ag, from `[Ag(CN)_(2)]^-` ion.

Solution :In silver plating `K[Ag(CN)_(2)]` is USED which PROVIDES constant and required supply of `Ag^(+)` ions as `Ag(CN)_(2)^(-)` is very stable. But if `AgNO_(3)` is used concentration of `[Ag^(+)]` in solution will be very large in that case Ag will be DEPOSITED at faster rate without any unit ormity.


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