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The epoxy bond between the heat sink and component is __________(a) Temporary(b) Loosened(c) Permanent/semi-permanent(d) HighendI got this question in an interview for job.My query is from Transistor Case and Heat Sinks in division Differential and Multistage Amplifiers of Electronic Devices & Circuits

Answer»

Right answer is (c) Permanent/semi-permanent

For explanation: The EPOXY bond between the heat sink and component is semi-permanent/permanent. This is done to make the re-work very difficult and at TIMES impossible. The most TYPICAL DAMAGE CAUSED by rework is the separation of the component die heat spreader from its package.



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