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The epoxy bond between the heat sink and component is __________(a) Temporary(b) Loosened(c) Permanent/semi-permanent(d) HighendI got this question in an interview for job.My query is from Transistor Case and Heat Sinks in division Differential and Multistage Amplifiers of Electronic Devices & Circuits |
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Answer» Right answer is (c) Permanent/semi-permanent |
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