What Are Steps Involved In Semiconductor Device Fabrication?

1.	What Are Steps Involved In Semiconductor Device Fabrication?
Answer» This is a list of processing techniques that are employed numerous times in a MODERN electronic device and do not necessarily imply a specific order. Wafer processing Wet cleans Photolithography Ion implantation (in which dopants are embedded in the wafer creating regions of increased (or decreased) CONDUCTIVITY) Dry etching Wet etching Plasma ashing Thermal treatments Rapid thermal anneal Furnace anneals Thermal oxidation Chemical vapor deposition (CVD) Physical vapor deposition (PVD) Molecular beam epitaxy (MBE) Electrochemical Deposition (ECD). See Electroplating Chemical-mechanical planarization (CMP) Wafer testing (where the electrical performance is verified) Wafer backgrinding (to reduce the thickness of the wafer so the RESULTING chip can be put into a thin device like a smartcard or PCMCIA card.) Die preparation Wafer mounting Die cutting IC packaging Die attachment IC Bonding Wire bonding Flip chip Tab bonding IC encapsulation Baking Plating Lasermarking Trim and form IC testing This is a list of processing techniques that are employed numerous times in a modern electronic device and do not necessarily imply a specific order.

Answer»

This is a list of processing techniques that are employed numerous times in a MODERN electronic device and do not necessarily imply a specific order.

Wafer processing
Wet cleans
Photolithography
Ion implantation (in which dopants are embedded in the wafer creating regions of increased (or decreased) CONDUCTIVITY)
Dry etching
Wet etching
Plasma ashing
Thermal treatments
Rapid thermal anneal
Furnace anneals
Thermal oxidation
Chemical vapor deposition (CVD)
Physical vapor deposition (PVD)
Molecular beam epitaxy (MBE)
Electrochemical Deposition (ECD). See Electroplating
Chemical-mechanical planarization (CMP)
Wafer testing (where the electrical performance is verified)
Wafer backgrinding (to reduce the thickness of the wafer so the RESULTING chip can be put into a thin device like a smartcard or PCMCIA card.)
Die preparation
Wafer mounting
Die cutting
IC packaging
Die attachment
IC Bonding
Wire bonding
Flip chip
Tab bonding
IC encapsulation
Baking
Plating
Lasermarking
Trim and form
IC testing

This is a list of processing techniques that are employed numerous times in a modern electronic device and do not necessarily imply a specific order.

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