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Answer» IC are packaged in many types they are:
- BGA1
- BGA2
- Ball grid array
- CPGA
- Ceramic ball grid array
- Cerquad
- DIP-8
- Die attachment
- Dual Flat No Lead
- Dual in-line package
- Flat pack
- Flip chip
- Flip-chip PIN grid array
- HVQFN
- LQFP
- LAND grid array
- Leadless chip carrier
- LOW insertion force
- Micro FCBGA
- Micro Leadframe Package
- MicroLeadFrame
- Mini-Cartridge
- Multi-Chip Module
- OPGA
- PQFP
- Package on package
- Pin grid array
- Plastic leaded chip carrier
- QFN
- QFP
- Quadruple in-line package
- ROM cartridge
- Shrink Small-Outline Package
- ingle in-line package
- Small-Outline Integrated Circuit
- Staggered Pin Grid Array
- Surface-mount technology
- TO220
- TO3
- TO92
- TQFP
- TSSOP
- Thin small-outline package
- Through-hole technology
- UICC
- Zig-zag in-line package
IC are packaged in many types they are:
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